Article · Wikipedia archive · Last revised Jun 14, 2026

350 nm process

The 350 nanometer process is a level of semiconductor process technology that was reached in the 1995–1996 timeframe by leading semiconductor companies like Intel and IBM.

Last revised
Jun 14, 2026
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≈ 1 min
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The 350 nanometer process (350 nm process) is a level of semiconductor process technology that was reached in the 1995–1996 timeframe by leading semiconductor companies like Intel and IBM.

Example processes

Products featuring 350 nm manufacturing process

References

References

  1. Logan, Andrew (1997-09-10). "RIVA 128 gains support as preferred Direct3D developer platform press release". NVIDIA Home. Archived from the original on 1998-06-13. Retrieved 2023-12-03.
  2. "Propeller I semiconductor process technology? Is it 350nm or 180nm?". Parallax Forums. Retrieved 2015-09-13.{{cite web}}: CS1 maint: deprecated archival service (link)
  3. Petryk, Dmytro; Dyka, Zoya (2018). "Optical Fault Injections: a Setup Comparison". S2CID 198917285. {{cite journal}}: Cite journal requires |journal= (help)
  4. Guillen, Oscar; Gruber, Michael; De Santis, Fabrizio (2017). "Low-Cost Setup for Localized Semi-invasive Optical Fault Injection Attacks: How Low Can We Go?". Constructive Side-Channel Analysis and Secure Design. Lecture Notes in Computer Science. Vol. 10348. pp. 207–222. doi:10.1007/978-3-319-64647-3_13. ISBN 978-3-319-64646-6.
Preceded by
600 nm
CMOS manufacturing processes Succeeded by
250 nm